Stiffness Tester Application: used for testing the stiffness of all kinds of textiles. Standard: GB/T18318，ISO9073-7， ASTM D1388，BSEN22313 Measuring angles 41.5°、43°、45° Dimension for platform 40×250mm Dimension of platen 25×250mm Speed of platen 3-5mm/s Dimension: 490×290×400mm(L×W×H) Power AC220V

Dial Force Gauge Feature simple operation precision peak value maintance indicate two scales Handheld design compact Easy operation Application electrics，components of Vehicle, Lighter & portfire , construction, fabric etc. capacity：10KG，20KG，30KG，50KG

*. Two independent heating zones, multitude temperature zones control, lead free process. *. Top heating zone use to infrared *. The bottom zone applies to far infrared to pre-heating to prevent PCB curve. *. Six-section temperature controls, simulates re-flower effect completely. *. Cooling PCB after heating, to prevent PCB deformation. *. BGA welding on completion of the demolition, a voice prompt *. Vacuum wand sucks BGA, convenient, reliable and durable *. Card board with a special tooling for a wide variety of notebook motherboard(option ) *. COM connection, connect with computer to achieve hi-end rework function.

1. The machine vision system with CCD on the BGAs solder ball back in the melting process of observation. 2. Intelligent heating wire, the fan does not turn, the hot wire is not powered. 3. Com interfaces, and computer connections, repair machines to achieve high-end features. 4. Rich software features: simple and friendly interface, set, modify, save the parameters, parameter sets no limit on the number; temperature curve test, analyze, print, save; automatic Track heating process,heating process curve of automatic drawing;temperature tuning,temperature error conrrection;password locking mechanism,permitting mechanism. 5. Three independent heating zones, suitable for lead-free process. 6. The first heating zone, the second heating zone heater materials with good heat, resulting in high wind, the third heating zone with warm far-infrared heat panels, adjustable support, to prevent the deformation of PCB board. 7. Six section temperature zones control,complete simulation of the effect of reflow soldering machine. 8. The first heating zone around the heater can be up and down adjustment, easy to operate. 9. In the heat flow after the constant use of a large cooling fan on the PCB board, PCB board to prevent deformation of the welding effect. 10. BGA removal, welding after the voice prompts. 11. Electric vacuum sucked document BGA, convenient, reliable and durable. 12. Tooling plate with a special card, for a variety of notebook motherboard. 13. With a variety of sizes of hot air nozzle, or customized according to special requirements. 14. With PLC, human machine interface control.

1.The instrument control, 8 sections of temperatures. Can save 10 groups of parameters. 2.Intelligent thermal fuse, it doesnt work when fan no working. 3.Three independent heating zones, suitable for lead free process. 4.It adapts quality heating material in 1st and 2nd heating zone, which produces hi- temperature and breeze, and far IR for 3rd heating zone pre-heat to prevent PCB deformation. 5.Upper heating system can be moving fro and back,up and down, and the bottom heating system can go up and down. 6.Sound hint function. 7.Big flow constant current cools PCB for better welding effort after Heating finish , prevent PCB deformation. 8.Portable vacuum pen takes out BGA,convenient and durable. 9.Special pallet for different main board. 10.Various sizes heating nozzles available, or custom made.